| GAM 70 Laser Vision
Measurement |
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- Ideal inspection for solder
paste thickness, dealing with the increasingly growth
of fine pitch, enhanced printing technology and high
precision requirement.
- Prevent virous kinds of defect
from printing process, such as the bridging, deviation
location, etc...
- Laser vision measurement,
without contact and damage.
- Statistical charts and process
capability index be provided as the real-time data
for quality control.
- Easy to operate, fast gather
the printing data for reference.
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【Function】
- Measure printed solder
thickness, height, length and interval.
- Providing various kind
of statistical charts, such as the distributive
thickness chart,
 -R
control chart and process capability index:
Cp, Cpm ,Cpk for reference.
- Analyze thickness for
solder cross-section.
- Inspect lengh and thickness
for other kinds of materials.
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【Application
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- Printed solder and copper.
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【Printing
For Control Chart】
- -R
control chart.
- Cp, Cpk, Cpm capability index.
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【Operation
And Measurement】
- Display image full of screen.
- Easy to sample.
- Easy to operate
- Real-time appearing the statistic.
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【Distributive
Thickness Chart】
- Display and print the distributive
thickneess chart.
- Disply and print all the
statistic.
- Analysis the percentage for
distributive thickness.
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| 【Specification】
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Vision Range (mm) |
4.55×3.5 mm2
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Magnification |
×50 ×90 |
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Table Size W×L(mm) |
350×265 mm2
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Resolution(mm) |
±0.0035 |
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Measurement Method |
Laser Vision |
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Screen |
15" LCD |
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Lens |
Color CCD Lens |
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Light |
Circular LED Lighting |
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Focus |
Thick / Ting adjustment |
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Power |
110V.60Hz / 220V.50Hz |
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Dimensions L×W×H(mm) |
350×400×350 mm3
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Weight |
30 kg |
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| 【View】 |
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| Above
View |
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| Front
View |
Lateral View |
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(Unit:mm) |
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